CVEvulnerability
CVE-2016-2063
7.8 HIGH
Official page ↗
- Status
- Modified
- Published
- 2016-08-07
- Last modified
- 2026-06-17
- Assigner
- [email protected]
- CVSS 3.1 ([email protected])
- 7.8 HIGH — CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
- CVSS 2.0 ([email protected])
- 4.6 MEDIUM — AV:L/AC:L/Au:N/C:P/I:P/A:P
- Weaknesses
- CWE-119
Description
Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface.
Affected configurations
• linux linux kernel (>= 3.0 <= 3.19.8)
Related
Weakness · CWE (1)
- CWE-119 Improper Restriction of Operations within the Bounds of a Memory Buffer weakness
References
- http://www.securityfocus.com/bid/92381 Third Party Advisory, VDB Entry
- https://us.codeaurora.org/cgit/quic/la/kernel/msm-3.10/commit/?id=ab3f46119ca10de87a11fe966b0723c48f27acd4 Mailing List, Patch, Third Party Advisory
- https://www.codeaurora.org/stack-overflow-msm-thermal-driver-allows-kernel-memory-corruption-cve-2016-2063 Broken Link
- http://www.securityfocus.com/bid/92381 Third Party Advisory, VDB Entry
- https://us.codeaurora.org/cgit/quic/la/kernel/msm-3.10/commit/?id=ab3f46119ca10de87a11fe966b0723c48f27acd4 Mailing List, Patch, Third Party Advisory
- https://www.codeaurora.org/stack-overflow-msm-thermal-driver-allows-kernel-memory-corruption-cve-2016-2063 Broken Link