CVEvulnerability

CVE-2017-18157

7.8 HIGH Published 2019-05-06 Modified 2026-06-17 Official page ↗
Status
Modified
Published
2019-05-06
Last modified
2026-06-17
Assigner
[email protected]
CVSS 3.0 ([email protected])
7.8 HIGH — CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
CVSS 2.0 ([email protected])
7.2 HIGH — AV:L/AC:L/Au:N/C:C/I:C/A:C
Weaknesses
CWE-416

Description

A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.

Affected configurations

• qualcomm mdm9206 firmware • qualcomm mdm9607 firmware • qualcomm mdm9650 firmware • qualcomm msm8909w firmware • qualcomm msm8996au firmware • qualcomm sd 210 firmware • qualcomm sd 212 firmware • qualcomm sd 205 firmware • qualcomm sd 425 firmware • qualcomm sd 450 firmware • qualcomm sd 615 firmware • qualcomm sd 616 firmware • qualcomm sd 415 firmware • qualcomm sd 625 firmware • qualcomm sd 650 firmware • qualcomm sd 652 firmware • qualcomm sd 820 firmware • qualcomm sd 820a firmware • qualcomm sd 835 firmware • qualcomm sd 845 firmware • qualcomm sdx20 firmware

Related

Weakness · CWE (1)

References