CVEvulnerability
CVE-2017-18173
7.8 HIGH
Official page ↗
- Status
- Modified
- Published
- 2019-05-06
- Last modified
- 2026-06-17
- Assigner
- [email protected]
- CVSS 3.0 ([email protected])
- 7.8 HIGH — CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
- CVSS 2.0 ([email protected])
- 7.2 HIGH — AV:L/AC:L/Au:N/C:C/I:C/A:C
- Weaknesses
- CWE-190
Description
In case of using an invalid android verified boot signature with very large length, an integer underflow occurs in Snapdragon Mobile in SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 810, SD 820, SD 835, SDM630, SDM636, SDM660, Snapdragon_High_Med_2016.
Affected configurations
• qualcomm sd 425 firmware
• qualcomm sd 427 firmware
• qualcomm sd 430 firmware
• qualcomm sd 435 firmware
• qualcomm sd 450 firmware
• qualcomm sd 625 firmware
• qualcomm sd 810 firmware
• qualcomm sd 820 firmware
• qualcomm sd 835 firmware
• qualcomm sdm630 firmware
• qualcomm sdm636 firmware
• qualcomm sdm660 firmware
• qualcomm snapdragon high med 2016 firmware
Related
Weakness · CWE (1)
- CWE-190 Integer Overflow or Wraparound weakness
References
- https://www.qualcomm.com/company/product-security/bulletins Vendor Advisory
- https://www.qualcomm.com/company/product-security/bulletins Vendor Advisory